Hello, I have designed an interposer board so that I may easily connect my JLink probe to the XIAO nRF528450 Sense. I found the footprint published by Seeed Studios for the XIAO Sense and I have a couple of boards manufactured. The first one is being tested now.
It looks like the pads for the SWD connection on the footprint are much larger than the very small pads on the XIAO Sense and the pads on the edge for the castellations are rather short. My first board is at least working, but I was wondering if anyone had had any problems with the big difference between the SWD pads on the XIAO Sense and the pads of the footprint and the pads for the castellations?
Thanks, Sid
Hi there,
So is there a reason you not using the Dev Expansion board with the POGO’s already on it, nRF52840 or you have a PLUS version ? (use the mate)
Here is some.. 
GL
PJ:v:
Thanks, I am aware of those options. The reason I made the interposer board was as an interim for use during development. Ultimately, the XIAO module needs to be mounted on a custom PCB along with all the other sensors etc. At that time, I want to be able to still be able to connect the JLink.
As I said, the interposer is working, I just was wondering if anyone had perhaps updated it.
Sid
it sounds like maybe it is a different XIAO maybe a cut and paste error
Sorry, I don’t know what you mean by cut and paste error?
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