Hi, I am laying out a PCB that possibly may go to manufacture later this year. My question for the purpose of manufacture is what spacing should be left between SMD parts that are going to be populated via PnP and reflow soldered. For example I have 4 0603 leds side by side and the spacing here is very tight.
What is the rule for the spacing between SMD pads for PnP and reflow soldering. Is it the same as it is for PCB manufacture or are there a different set of guidelines? If so where can I find these?
Thanks for any insight.