Dear Fusion PCB Team,
I would like to use your PCB service to prototype a somewhat high frequency (max freq is about 3.25 GHz). I have several questions:
- Can you provide more detalied information about the 1.6mm 4-layer board stack-up i.e., the relative permittivity and thickness of all substrate layers and copper widths on all layers?
- What is the thickness of the trace to get a 50 Ohm microstrip on top layer?
- What is the thickness of the trace to get a 50 Ohm asymmetric strip line on third layer?
- Can you do via-in-pad? If yes, what is the minimum size for a pad to have 0.3mm*0.6mm via inside?
Thanks in advance.