Hello –
First post.
I wish to build the 4-layer sandwich as described in this Seeed Wiki:
The Wiki seems to be a rough draft, as evidenced by the following …
Step 2: Resolder the pin header of the XIAO expansion board
In order to install the GNSS module at the bottom of the XIAO Expansion board through pin to pin connection, it is necessary to resolder the female header of the XIAO Expansion board and replace it with a female header equipped with male pins.
This seemed off from the start, as the pogos on the expansion board would be grounding on the shielding of L76 GNSS module. Right? In order to realise pin-to-pin connxn atop the expansion board the L76 module needs to be flipped upside down because of the board’s physical pin mapping.
So, seemingly placing the L76 GNSS board at the bottom, and stacking the ESP32S3 + Wio SX1262 above, is not going to work.
So, I thought, what about mounting the L76 atop the ESP32-LoRa boards as mounted atop the Xiao Expansion board? Well, how would I address the pin-to-pin connxns? Stacking headers all the way through? That’s like whacking down a handful of stacking headers to keep the profile low. And this begs the question of possible loss of B2B connxn between ESP32-S3 and its companion LoRa board. That question would be, “Will pin connections between ESP32-S3 and Wio-SX1262 retain same function whether I connect via pin headers or B2B connector?”
There is not a lot of documentation on this particular project. Any insights from those who have attempted this project would be very much appreciated. Included photo shows the boards I have at hand.
Thank you.